SEDL / STP / STP804-EB / STP36168S

Reduced-Pressure Chemical Vapor Deposition of Polycrystalline Silicon

Hammond, ML
Vice President, Technical Director, TETRON Inc., Cupertino, Calif.

Pages: 12    Published: Jan 1983

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Abstract

The practice of depositing polycrystalline silicon by low-pressure chemical vapor deposition (LPCVD) is discussed in terms of effect of deposition parameters on structural property relationships. Electrical and oxidation properties are also discussed.