SEDL / STP / STP804-EB / STP36163S

Considerations of Resist Processing

Bowden, MJ
Bell Laboratories, Murray Hill, N.J.

Frackoviak, J
Bell Laboratories, Murray Hill, N.J.

Pages: 19    Published: Jan 1983

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Abstract

Resist processing is taken here to refer to the variety of steps performed on the resist pursuant to defect-free pattern delineation. These processing steps include spin coating, pre-baking, exposure, post-exposure curing, development, and post-development treatment (post-baking, plasma de-scumming, etc.). Not all of these processing steps are necessarily performed, since the particular processing steps chosen, together with their operational sequence, are dictated by the chemical and physical properties of the resist. This paper discusses some of the considerations pertinent to process optimization of several electron resists and shows how processing relates to sensitivity, resolution, and defect levels.