SEDL / STP / STP664-EB / STP35793S



Electron Microscopy Study of Erosion Damage in Copper

Ives, LK
Physicist and acting division chief, National Bureau of Standards, Washington, D.C.

Ruff, AW
Physicist and acting division chief, National Bureau of Standards, Washington, D.C.


Pages: 31    Published: Jan 1979


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Abstract

Solid-particle erosion data have been reported for many materials. The mechanics of the impact process has also been examined. However, relatively little effort has been expended in studying the microstructural aspects of material response to erosion. Effects such as deformation hardening, plastic flow, and particle embedding are recognized as being important but have not been subjected to careful study. Understanding the erosion mechanism at large attack angles and accounting for differences in erosion behavior of different metals and alloys are areas where knowledge of materials response factors will be most important. In the present work surface and subsurface erosion damage in copper is investigated by transmission and scanning electron microscopy techniques.


Keywords:
erosion, impingement erosion, copper, wear, electron microscopy, metal erosion

Paper ID: STP35793S
Committee/Subcommittee: G02.10
DOI: 10.1520/STP35793S
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