STP631: Stress Intensities for Cracks Emanating from Pin-Loaded Holes

    Smith, CW
    Professor, lecturer, and graduate research assistant, Virginia Polytechnic Institute and State University, Blacksburg, Va.

    Jolles, M
    Professor, lecturer, and graduate research assistant, Virginia Polytechnic Institute and State University, Blacksburg, Va.

    Peters, WH
    Professor, lecturer, and graduate research assistant, Virginia Polytechnic Institute and State University, Blacksburg, Va.

    Pages: 12    Published: Jan 1977


    Abstract

    A series of stress freezing photoelastic experiments were conducted on large plates containing central holes with cracks emanating from the edge formed by the intersection of the hole with the plate surface. Loads were applied through rigid pins with neat fits in the holes. Stress-intensity factors (SIF) were estimated by a computer assisted least squares analysis of the photoelastic data taken from slices near the points of intersection of the flaw border with the hole boundary and the plate surface. Results indicate that the local mode of loading changes from Mode I near the hole boundary to mixed mode near the plate surface. The analysis is extended to include mixed mode loading, and results are compared with an existing approximate theory.

    Keywords:

    crack propagation, photoelasticity, fracture mechanics, stress intensity factors, fractures (materials), stresses


    Paper ID: STP35540S

    Committee/Subcommittee: E08.08

    DOI: 10.1520/STP35540S


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