STP893

    Design Analysis and Testing for Mixed-Mode and Mode II Interlaminar Fracture of Composites

    Published: Jan 1986


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    Abstract

    This paper presents the design analysis and results of an experimental program that was conducted to evaluate mixed-mode and Mode II interlaminar fracture behavior of a resin matrix composite material system. A double cracked-lap-shear specimen was designed utilizing a simple, new analysis method. The specimen was made of AS4/3502 graphite/epoxy material with a [±45, 0, 90]6s quasi-isotropic balanced symmetric layup. The lap interface studied was at ±45° orientations to the loading direction. A fundamental feature of the designed specimen is its ability to be tested under net tensile and compressive loadings. The specimen exhibits mixed-mode or Mode II behavior depending on the loading direction. This paper summarizes the tension testing only. The crack growth during testing was monitored by observing the isochromatic fringes in photoelastic coatings mounted on the two lap surfaces. Preliminary results indicate that the fracture behavior follows a resistance curve. In order to assess the double cracked-lap-shear specimen data and test, a comparison was made with results obtained with single cracked-lap-shear specimens. Less scatter in the data from the double cracked-lap-shear specimens was found.

    Keywords:

    composite materials, fiber-reinforced composites, composite structures, graphite-epoxy, crack propagation, fracture (materials), delamination, scanning electron microscopy, test methods


    Author Information:

    Armanios, EA
    Research engineer, professor, and senior research engineer, School of Aerospace Engineering, Georgia Institute of Technology, Atlanta, GA

    Rehfield, LW
    Research engineer, professor, and senior research engineer, School of Aerospace Engineering, Georgia Institute of Technology, Atlanta, GA

    Reddy, AD
    Research engineer, professor, and senior research engineer, School of Aerospace Engineering, Georgia Institute of Technology, Atlanta, GA


    Paper ID: STP35351S

    Committee/Subcommittee: D30.06

    DOI: 10.1520/STP35351S


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