SEDL / STP / STP697-EB / STP35077S



On-Line Safety Monitoring of a Large High Pressure High Temperature Autoclave

Tatro, CA
Research and advanced development engineer, technical associate, coordinator, and technician, Lawrence Livermore Laboratory, Livermore, Calif

Brown, AE
Research and advanced development engineer, technical associate, coordinator, and technician, Lawrence Livermore Laboratory, Livermore, Calif

Freeman, TH
Research and advanced development engineer, technical associate, coordinator, and technician, Lawrence Livermore Laboratory, Livermore, Calif

Yanes, G
Research and advanced development engineer, technical associate, coordinator, and technician, Lawrence Livermore Laboratory, Livermore, Calif


Pages: 21    Published: Jan 1979


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Abstract

Four years of experience with on-line monitoring of a large autoclave used primarily for forming bonds and material densification is reported. The purpose of this work is to confirm that no flaws are growing in the autoclave during operation. Failure of this device during operation could endanger personnel and would damage property. Its loss would seriously curtail several ongoing research efforts.

The vessel is monitored with a commercial minicomputerized flaw location system. Four 4-sensor arrays are attached to the exterior of the device to receive acoustic emission signals. Computed locations are stored on cassette tape and selected portions can be displayed on a cathode ray screen. It is shown that although the minicomputer is implemented with two dimensional location software, the information can be reprocessed in a central computer to produce locations in three dimensions.

Long-term storage of data, data display, noise analysis, calibration, and computerized location error analysis is discussed.

No degradation by flaw growth has been detected in this device to date. This is the expected result, since it has an estimated 30-year life.


Keywords:
acoustic emission, pressure vessel, autoclave, nondestructive inspection, flaw growth, on-line monitoring, flaw location

Paper ID: STP35077S
Committee/Subcommittee: E07.04
DOI: 10.1520/STP35077S
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