Fundamental and Operational Glass Transition Temperatures of Composite Resins and Adhesives

    Published: Jan 1978

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    Data are presented on the thermomechanical response and electrical conductivity of two commonly used epoxy materials, Narmco 5208 resin and RB 398 adhesive, as a function of increasing temperature. The overall conformity of the results shows that the second-order Ehrenfest-type glass transition temperature, designated as T2, governs the onset and evolution of changes in viscoelastic and electrical response as well as thermal expansion. The general features of this behavior are described with a five-element spring-and-dashpot model. The values of T2, and two other Williams-Landel-Ferry (WLF)-type parameters for the description of viscoelastic response above T2, can thus be derived from a single thermomechanical or electrical conductivity experiment conducted at constant heating rate.


    composite materials, resin, adhesive, glass transition temperature, viscoelasticity

    Author Information:

    Carter, HG
    General Dynamics Corp., Fort Worth, Tex.

    Kibler, KG
    General Dynamics Corp., Fort Worth, Tex.

    Reynolds, JD
    General Dynamics Corp., Fort Worth, Tex.

    Committee/Subcommittee: D30.04

    DOI: 10.1520/STP34859S

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