|
Solder Bloom Corrosion Analysis Based on Field Survey Data, Potential Causes, and Resolution Pages: 21 Published: Jan 1986
Download this paper for $25
PDF (568K)
View License Agreement Source: STP887-EB Abstract A method to analyze field survey data on the solder bloom corrosion in copper/brass radiators is presented. In an effort to distinguish various manufacturers' radiator products according to their solder bloom corrosion performance, a corrosion index number is introduced (Park's Solder Bloom Corrosion Index). Using this technique, the solder bloom corrosion susceptibility of various manufacturers' radiators can be forceranked as a function of miles-in-service and months-in-service. Potential causes for the solder bloom corrosion in the copper/brass radiators are analyzed from the standpoint of coolant type used, solder type used, different soldering processes, various internal rinse systems, and so forth. Based on the data analysis, a number of recommendations are presented for the potential resolution of solder bloom corrosion. Keywords: solder bloom corrosion, field survey data, copper/brass radiator, corrosion index number, Park's Solder Bloom Corrosion Index, force-rank, miles-in-service, months-in-service, coolant, solder, soldering process, internal rinse system Paper ID: STP32978S Committee/Subcommittee: D15.21 DOI: 10.1520/STP32978S ASTM International is a member of CrossRef. | ||