SEDL / STP / STP887-EB / STP32978S

Solder Bloom Corrosion Analysis Based on Field Survey Data, Potential Causes, and Resolution

Park, KH
Engineering supervisor, Product Engineering Office, Climate Control Division, Ford Motor Co., Dearborn, MI

Pages: 21    Published: Jan 1986

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Abstract

A method to analyze field survey data on the solder bloom corrosion in copper/brass radiators is presented. In an effort to distinguish various manufacturers' radiator products according to their solder bloom corrosion performance, a corrosion index number is introduced (Park's Solder Bloom Corrosion Index). Using this technique, the solder bloom corrosion susceptibility of various manufacturers' radiators can be forceranked as a function of miles-in-service and months-in-service.

Potential causes for the solder bloom corrosion in the copper/brass radiators are analyzed from the standpoint of coolant type used, solder type used, different soldering processes, various internal rinse systems, and so forth. Based on the data analysis, a number of recommendations are presented for the potential resolution of solder bloom corrosion.