STP850: New Applications of Tape Bonding for High Lead Count Devices

    Marshall, JF
    Executive Vice President and cofounderApplications and Equipment Engineering Manager, MESA TechnologyMESA Technology, Mountain View, CA

    Sheppard, RP
    Executive Vice President and cofounderApplications and Equipment Engineering Manager, MESA TechnologyMESA Technology, Mountain View, CA

    Pages: 12    Published: Jan 1984


    Abstract

    There are two primary forces which drive the interconnect market: the first is manufacturing cost, and the second is system performance. In the past, tape automated bonding (TAB) was viewed as an interconnection technology which offered a cost advantage; however, only a handful of semiconductor manufacturers with high volume, low lead count product lines were able to demonstrate a cost savings with TAB over conventional automatic wirebonding.

    Recently, however, development work and usage of TAB has been accelerating due to performance considerations in the interconnection of increasingly complex VLSI devices. VHSIC speeds are forcing new approaches to packaging and interconnection. TAB offers a practical solution to many of these performance problems. TAB leads offer improved electrical, thermal and mechanical properties in addition to doubling the I/O density capability for perimeter pad configurations compared to conventional wirebonding. Furthermore, TAB technology affords the potential to accommodate I/O pads anywhere on the surface of the device through the use of a multilayer “area array” or “decal” tape interconnect pattern.

    Keywords:

    Tape Automated Bonding (TAB), high lead count, interconnection, packaging, gate array, VLSI, VHSIC


    Paper ID: STP32675S

    Committee/Subcommittee: F01.07

    DOI: 10.1520/STP32675S


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