STP850: Capacitive Microphone Tuning of Ultrasonic/Thermosonic Bonders

    Loofbourrow, WL
    manufacturing engineer at Hewlett-Packard, Microwave Technology Center Division, Santa Rosa, CA

    Pages: 13    Published: Jan 1984


    Abstract

    Scheduling ultrasonic bonders for optimum settings has long been a mystery. As device bond pads get smaller and silicon and gallium arsenide devices get thinner, ultrasonic energy control at the bond interface becomes very critical. The use of a capacitive microphone sound meter to measure the compressional sound waves at the lower tip of a bonding tool has helped to control these critical energy settings. The results of implementing this process on 25 thermosonic bonders has reduced the damage to microwave devices by 30% and decreased the wire bond assembly time 25%.

    Keywords:

    dB pressure level, ultrasonic power node, matte finish, compressional sound waves, capacitive microphone tuning, capacitive bonder tuning


    Paper ID: STP32673S

    Committee/Subcommittee: F01.07

    DOI: 10.1520/STP32673S


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