SEDL / STP / STP850-EB / STP32672S

The Annealing and Low Temperature Aging Characteristics of Fine Diameter Wire Produced from Dilute Aluminum Alloys

Hebert, DF
Semiconductor Packaging/Materials Engineer, Siliconix, Inc., Santa Clara, CA

Pages: 14    Published: Jan 1984

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Abstract

Compared are the ultrasonic bonding, annealing and low temperature aging characteristics of one mil Al-1 pct Si, Al-1 pct Mg, and Al-½ pct Mg bonding wires. Ultimate tensile strengths and average bond pull strengths of these three alloys decrease similarly in the 125° to 200°C temperature range, while dissimilarity was observed in elongation: Al-Mg alloys become more ductile and Al-1 pct Si embrittles. Aging to −65°C showed no changes in the mechanical properties of Al-½ pct Mg but caused embrittlement in Al-1 pct Mg, suggesting GP zone formation.