STP850

    The Annealing and Low Temperature Aging Characteristics of Fine Diameter Wire Produced from Dilute Aluminum Alloys

    Published: Jan 1984


      Format Pages Price  
    PDF (180K) 14 $25   ADD TO CART
    Complete Source PDF (9.7M) 14 $66   ADD TO CART


    Abstract

    Compared are the ultrasonic bonding, annealing and low temperature aging characteristics of one mil Al-1 pct Si, Al-1 pct Mg, and Al-½ pct Mg bonding wires. Ultimate tensile strengths and average bond pull strengths of these three alloys decrease similarly in the 125° to 200°C temperature range, while dissimilarity was observed in elongation: Al-Mg alloys become more ductile and Al-1 pct Si embrittles. Aging to −65°C showed no changes in the mechanical properties of Al-½ pct Mg but caused embrittlement in Al-1 pct Mg, suggesting GP zone formation.

    Keywords:

    Dilute aluminum alloys, microelectronic interconnects, fine diameter wire, ultrasonic bonding, annealing characteristics, low temperature aging, mechanical properties, GP zone formation


    Author Information:

    Hebert, DF
    Semiconductor Packaging/Materials Engineer, Siliconix, Inc., Santa Clara, CA


    Paper ID: STP32672S

    Committee/Subcommittee: F01.07

    DOI: 10.1520/STP32672S


    CrossRef ASTM International is a member of CrossRef.