Digital Library / STP / STP850-EB / STP32671S



The Ball Bond Shear Test: Its Methodology and Application


Pages: 29    Published: Jan 1984


Download this paper for $25 PDF (496K)          View License Agreement
        Click here to download the complete source publication for $66 PDF (9.6M)


Source: STP850-EB


Abstract

Results of a comprehensive ball shear testing program are presented including methods for ball shear implementation and wire bonding machine optimization. Both destructive and non-destructive ball shear are considered as complementary test methods to the more familiar wire bond pull test. Techniques for on-line production testing are presented along with suggested guidelines suitable for incorporation in a standard test method. The use of ball shear testing as a method for studying the effect of both thermal processing and contamination on the strength and morphology of the aluminum-gold interface is also considered.


Keywords:
ball bonds, shear test, wire bonds, bonding, hybrid bonding, thermosonic bonding, ball bond testing, wire bond testing, hybrid bond testing, semiconductor wire bonds, semiconductor wire bond testing

Paper ID: STP32671S
Committee/Subcommittee: F01.07
DOI: 10.1520/STP32671S
CrossRef ASTM International is a member of CrossRef.