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The Ball Bond Shear Test: Its Methodology and Application Pages: 29 Published: Jan 1984
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View License Agreement Source: STP850-EB Abstract Results of a comprehensive ball shear testing program are presented including methods for ball shear implementation and wire bonding machine optimization. Both destructive and non-destructive ball shear are considered as complementary test methods to the more familiar wire bond pull test. Techniques for on-line production testing are presented along with suggested guidelines suitable for incorporation in a standard test method. The use of ball shear testing as a method for studying the effect of both thermal processing and contamination on the strength and morphology of the aluminum-gold interface is also considered. Keywords: ball bonds, shear test, wire bonds, bonding, hybrid bonding, thermosonic bonding, ball bond testing, wire bond testing, hybrid bond testing, semiconductor wire bonds, semiconductor wire bond testing Paper ID: STP32671S Committee/Subcommittee: F01.07 DOI: 10.1520/STP32671S ASTM International is a member of CrossRef. | ||