SEDL / STP / STP850-EB / STP32671S

The Ball Bond Shear Test: Its Methodology and Application

Charles, HK
Principal Staff Engineer and Assistant SupervisorAssociate Staff PhysicistSenior Staff Chemistmembers, Microelectronics Group at The Johns Hopkins University APPLIED PHYSICS LABORATORY (APL)Microelectronics Group at APL, Laurel,Maryland

Clatterbaugh, GV
Principal Staff Engineer and Assistant SupervisorAssociate Staff PhysicistSenior Staff Chemistmembers, Microelectronics Group at The Johns Hopkins University APPLIED PHYSICS LABORATORY (APL)Microelectronics Group at APL, Laurel,Maryland

Weiner, JA
Principal Staff Engineer and Assistant SupervisorAssociate Staff PhysicistSenior Staff Chemistmembers, Microelectronics Group at The Johns Hopkins University APPLIED PHYSICS LABORATORY (APL)Microelectronics Group at APL, Laurel,Maryland

Pages: 29    Published: Jan 1984

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Source: STP850-EB

Abstract

Results of a comprehensive ball shear testing program are presented including methods for ball shear implementation and wire bonding machine optimization. Both destructive and non-destructive ball shear are considered as complementary test methods to the more familiar wire bond pull test. Techniques for on-line production testing are presented along with suggested guidelines suitable for incorporation in a standard test method. The use of ball shear testing as a method for studying the effect of both thermal processing and contamination on the strength and morphology of the aluminum-gold interface is also considered.

Keywords:
ball bonds, shear test, wire bonds, bonding, hybrid bonding, thermosonic bonding, ball bond testing, wire bond testing, hybrid bond testing, semiconductor wire bonds, semiconductor wire bond testing

Paper ID: STP32671S
Committee/Subcommittee: F01.07
DOI: 10.1520/STP32671S
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