|
The Effect of Wafer Flatness on Yield by Off-Line Computer Simulation of the Photolithographic Process Pages: 17 Published: Jan 1984
Download this paper for $25
PDF (408K)
View License Agreement Source: STP850-EB Abstract This paper describes a powerful new computer program which has the ability to directly simulate virtually all popular projection and stepper type aligners. The effects on yield of such metrologies as global wafer retilting, exposure by exposure retilting and autofocusing will be analyzed. Three point and the new seven point mirror projection aligner image plate geometries will also be characterized. The results of several process simulations will be presented using the new program's powerful graphic displays which yield a view of wafer shape never seen before. Keywords: wafer flatness characterization, microphotolithography, phase-modulated grazing-incidence interferometer, computer simulation, yield enhancement, relative focal plane, depth of focus Paper ID: STP32649S Committee/Subcommittee: F01.15 DOI: 10.1520/STP32649S ASTM International is a member of CrossRef. | ||