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An Examination of Mixed-Mode Debonding in the Blister Test Pages: 15 Published: Jan 1988
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View License Agreement Source: STP981-EB Abstract Crack opening displacements normal to the plane of an interface crack in a blister specimen are measured using optical interferometry. The displacements are measured up to and including the onset of crack growth and are used to define limits of elastic and inelastic elastic behavior and examine mixed-mode fracture criteria. The extent of inelastic behavior increases with increasing shear component and dominates the onset of crack growth in a bimaterial combination of glass and epoxy. Keywords: interfacial debonding, glass/epoxy, mixed-mode fracture, crack opening interferometry, nonlinear effects Paper ID: STP30324S Committee/Subcommittee: D14.03 DOI: 10.1520/STP30324S ASTM International is a member of CrossRef. | ||