SEDL / STP / STP839-EB / STP30213S

Application of Quantitative Metallography to the Analysis of Grain Growth During Liquid-Phase Sintering

Petzow, G
Professor, Max-Planck-Institut für Metallforschung, Institut für Werkstoffwissenschaften, Stuttgart,

Takajo, S
Senior researcher,

Kaysser, WA
Visiting scientist, Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, Mass.

Pages: 12    Published: Jan 1984

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Abstract

During liquid-phase sintering of iron/copper and various other systems, particle contacts involving grain boundaries with low energy, that is, with large dihedral angles, were frequently observed. By means of electron channeling pattern investigations on a copper/silver system, such low-energy grain boundaries were proved to be low-indexed coincidence boundaries. With the assumption that particle coalescence following the low-energy boundary formation mainly contributes to particle growth, the growth behaviors were treated generally on a statistical basis and then correlated with the special case of iron/copper. Average particle sizes and particle size distributions were calculated and compared with experimental results. It was found that coalescence contributes significantly to particle growth.