SYMPOSIA PAPER Published: 01 January 1983
STP28538S

Chemorheological Characterization of B-Stage Printed Wiring Board Resins

Source

High-performance liquid chromatography (HPLC), gel permeation chromatography (GPC), dynamic mechanical analysis, and differential scanning calorimetry (DSC) have been used to characterize printed wiring board B-stage FR-4 epoxy resins. These techniques demonstrate a capability for fingerprinting the formulations and their thermal and rheological behavior. The relation between gelation and viscoelastic properties has also been examined. The results reveal a new and reproducible method of detecting the onset of gelation. The merit of each technique as a quick quality-control method is evaluated.

Author Information

Tung, CM
Rockwell International Science Center, Thousand Oaks, Calif.
Dynes, PJ
Rockwell International Science Center, Thousand Oaks, Calif.
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Details
Developed by Committee: D30
Pages: 38–53
DOI: 10.1520/STP28538S
ISBN-EB: 978-0-8031-4863-5
ISBN-13: 978-0-8031-0234-7