SEDL / STP / STP797-EB / STP28538S

Chemorheological Characterization of B-Stage Printed Wiring Board Resins

Tung, CM
Member Technical Staff, Rockwell International Science Center, Thousand Oaks, Calif.

Dynes, PJ
Member Technical Staff, Rockwell International Science Center, Thousand Oaks, Calif.

Pages: 16    Published: Jan 1983

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Abstract

High-performance liquid chromatography (HPLC), gel permeation chromatography (GPC), dynamic mechanical analysis, and differential scanning calorimetry (DSC) have been used to characterize printed wiring board B-stage FR-4 epoxy resins. These techniques demonstrate a capability for fingerprinting the formulations and their thermal and rheological behavior. The relation between gelation and viscoelastic properties has also been examined. The results reveal a new and reproducible method of detecting the onset of gelation. The merit of each technique as a quick quality-control method is evaluated.