STP797

    Chemorheological Characterization of B-Stage Printed Wiring Board Resins

    Published: Jan 1983


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    Abstract

    High-performance liquid chromatography (HPLC), gel permeation chromatography (GPC), dynamic mechanical analysis, and differential scanning calorimetry (DSC) have been used to characterize printed wiring board B-stage FR-4 epoxy resins. These techniques demonstrate a capability for fingerprinting the formulations and their thermal and rheological behavior. The relation between gelation and viscoelastic properties has also been examined. The results reveal a new and reproducible method of detecting the onset of gelation. The merit of each technique as a quick quality-control method is evaluated.

    Keywords:

    chemorheological characterization, epoxy resins, gelation


    Author Information:

    Tung, CM
    Member Technical Staff, Rockwell International Science Center, Thousand Oaks, Calif.

    Dynes, PJ
    Member Technical Staff, Rockwell International Science Center, Thousand Oaks, Calif.


    Paper ID: STP28538S

    Committee/Subcommittee: D30.08

    DOI: 10.1520/STP28538S


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