STP745

    Effect of Stable Crack Growth on Fracture Toughness Determination for Hot-Pressed Silicon Nitride at Elevated Temperatures

    Published: Jan 1981


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    Abstract

    Fracture toughness of hot-pressed silicon nitride was determined between room temperature and 1300°C using four-point bend specimens with straight-through and chevron notches. For T > 1100°C fracture toughness increases due to crack branching and secondary cracking caused by the viscous flow of the grain boundary phase. To determine correct K-values with the specimens having a straight-through notch the stable crack extension at T > 1100°C has to be taken into account.

    Keywords:

    silicon nitride, fracture toughness, high temperature, stable crack extension, composite materials, crack propagation


    Author Information:

    Munz, D
    University of Karlsruhe,

    Himsolt, G
    Research engineers, Deutsche Forschungs-und Versuchsanstalt für Luft-und Raumfahrt, Cologne,

    Eschweiler, J
    Research engineers, Deutsche Forschungs-und Versuchsanstalt für Luft-und Raumfahrt, Cologne,


    Paper ID: STP28298S

    Committee/Subcommittee: E08.08

    DOI: 10.1520/STP28298S


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