STP637: Analysis of Crack Growth Following Compressive High Loads Based on Crack Surface Displacements and Contact Analysis

    Dill, HD
    Section chief and senior engineer, Technology, McDonnell Aircraft Company, St. Louis, Mo

    Saff, CR
    Section chief and senior engineer, Technology, McDonnell Aircraft Company, St. Louis, Mo

    Pages: 12    Published: Jan 1977


    Abstract

    A method for prediction of crack growth behavior based on analysis of crack surface contact stresses has been extended to include compressive effects. The method is based on evaluations of the effective minimum stress intensity occurring during a load cycle. An analysis of crack surface displacements during loading and unloading is used to determine the permanent plastic deformation left in the wake of the growing crack. Contact stresses are determined by treating the interference as a wedge between the crack surfaces and performing an elastic-plastic analysis of stresses caused by the wedge. Comparisons of predictions with test data show the method can accurately account for the effects of compression loads. stresses, strains, crack propagation

    Keywords:

    stresses, strains, crack propagation


    Paper ID: STP27992S

    Committee/Subcommittee: E08.06

    DOI: 10.1520/STP27992S


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