SYMPOSIA PAPER Published: 01 January 1977
STP26951S

Evaluation of Composite Curing Stresses

Source

A recently developed approach to predict the initial stress field within a composite laminate after fabrication processing is examined in some detail. In this approach, the material response is assumed to be elastic with temperature-dependent properties. With the introduction of the concept of a stress-free temperature, it is shown that this position is defensible by use of deformation measurements on unsymmetric angle-ply units. Implications concerning the influence of the curing stress field on initial damage level (first-ply failure) are studied analytically. The predictions indicate a marked effect of curing stress in certain laminates. The consequences of combined moisture and thermal effects on initial damage level also are discussed.

Author Information

Pagano, NJ
Air Force Materials Laboratory, Wright-Patterson Air Force Base, Ohio
Hahn, HT
University of Dayton Research Institute, Dayton, Ohio
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Details
Developed by Committee: D30
Pages: 317–329
DOI: 10.1520/STP26951S
ISBN-EB: 978-0-8031-4690-7
ISBN-13: 978-0-8031-4490-3