STP617: Evaluation of Composite Curing Stresses

    Pagano, NJ
    Materials research engineer, Air Force Materials Laboratory, Wright-Patterson Air Force Base, Ohio

    Hahn, HT
    University of Dayton Research Institute, Dayton, Ohio

    Pages: 13    Published: Jan 1977


    Abstract

    A recently developed approach to predict the initial stress field within a composite laminate after fabrication processing is examined in some detail. In this approach, the material response is assumed to be elastic with temperature-dependent properties. With the introduction of the concept of a stress-free temperature, it is shown that this position is defensible by use of deformation measurements on unsymmetric angle-ply units. Implications concerning the influence of the curing stress field on initial damage level (first-ply failure) are studied analytically. The predictions indicate a marked effect of curing stress in certain laminates. The consequences of combined moisture and thermal effects on initial damage level also are discussed.

    Keywords:

    composite materials, laminates, stresses, deformation, measurement, residual stress


    Paper ID: STP26951S

    Committee/Subcommittee: D30.04

    DOI: 10.1520/STP26951S


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