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Advanced VLSI Isolation Technologies Pages: 19 Published: Jan 1989
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View License Agreement Source: STP990-EB Abstract Common issues in VLSI isolation technologies have been identified. Based on these issues, a critical review of conventional and novel isolation technologies such as oxide, trench, SEG, SOS, SIMOX, and ZMR is presented in this paper. Keywords: VLSI, isolation, oxide isolation, trench isolation, SEG, SOI, SOS, SIMOX, ZMR Paper ID: STP26046S Committee/Subcommittee: F01.06 DOI: 10.1520/STP26046S ASTM International is a member of CrossRef. | ||