SYMPOSIA PAPER Published: 01 January 1989
STP26026S

Silicon Slice Fracture Analysis

Source

Slice fracture problems can occur in a host of bare slice and patterned wafer fabrication processes. Some knowledge of how to diagnose the source of the fracture can aid in timely response to such problems. The purpose of this paper is to describe some of the tools and the techniques for analyzing silicon slice fractures. Included are: 1) a review of fracture markings in silicon similar to those in glasses and ceramics, plus a new marking that appears on crystalline fracture surfaces, 2) a description of inspection techniques and equipment and, 3) mention of some simple testing techniques. Examples are given of the use of markings and techniques in deducing probable causes of fracture and in enhancing process development in wafer fabrication.

Author Information

Dyer, LD
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Details
Developed by Committee: F01
Pages: 18–29
DOI: 10.1520/STP26026S
ISBN-EB: 978-0-8031-5107-9
ISBN-13: 978-0-8031-1273-5