STP960

    Production Monitoring of 200MM Wafer Processing

    Published: Jan 1987


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    Abstract

    A successful transition to 200mm wafers requires careful monitoring of substrate quality and rapid feedback on process performance. Sheet resistance mapping will play a key role in this transition because it allows precise control of repeatability and uniformity for a wide range of processes. The critical role of sheet resistance mapping in the transition to larger wafers will be reviewed. Advanced, fully automated sheet resistance mapping systems, capable of measuring 200mm wafers, will also be discussed. Data obtained from 200mm wafers will be presented for various process applications, including epitaxial and metal deposition, and ion implantation.

    Keywords:

    resistivity, sheet resistance, uniformity, large diameter wafers, 3-D maps, contour maps, diameter scans, ion implantation, epitaxial layers, trend analysis


    Author Information:

    Keenan, WA
    Prometrix Corporation, Santa Clara, CA

    Johnson, WH
    Prometrix Corporation, Santa Clara, CA

    Smith, AK
    Prometrix Corporation, Santa Clara, CA


    Paper ID: STP25795S

    Committee/Subcommittee: F01.06

    DOI: 10.1520/STP25795S


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