STP1080

    Mechanical and Thermal Properties of Silicon-Carbide Particle-Reinforced Aluminum

    Published: Jan 1990


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    Abstract

    Increasingly stringent structural and electronic packaging requirements have exceeded the capabilities of traditionally used metallic materials in many applications. Metal matrix composites (MMCs) are potential replacements. Silicon-carbide particle-reinforced aluminum (SiCp/Al) is an attractive candidate because of its excellent mechanical properties, tailorable coefficient of thermal expansion (CTE) and high thermal conductivity. At present, there is very limited property data available for this material. This paper presents material properties of selected SiCp/Al composites, evaluated at the General Electric Astro Space Division, including a discussion of the test methods used in their evaluation.

    Keywords:

    composite materials, thermal properties, mechanical properties, silicon-carbide particle-reinforced aluminum, metal matrix composites, packaging materials, silicon-carbide particle-reinforced aluminum applications, light-weight composite materials


    Author Information:

    Schmidt, K
    Chemical engineer, and Advanced Technology Manager and Division Fellow, General Electric Company, King of Prussia, PA

    Zweben, C
    Chemical engineer, and Advanced Technology Manager and Division Fellow, General Electric Company, King of Prussia, PA

    Arsenault, R
    Professordirector, University of MarylandCrystal Growth and Materials Testing Associates, Lanham, MD


    Paper ID: STP25398S

    Committee/Subcommittee: D30

    DOI: 10.1520/STP25398S


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