STP937: Screening of Advanced Matrix Resin Systems for Use in High Performance Aircraft

    Boschan, RH
    Research/development engineer, research specialist, and research engineer, Lockheed-California Co., Materials & Processes, Burbank, CA

    Tajima, YA
    Research scientist senior, Kelly Johnson Research Center,

    Forsberg, GA
    Research/development engineer, research specialist, and research engineer, Lockheed-California Co., Materials & Processes, Burbank, CA

    Hull, G
    Research/development engineer, research specialist, and research engineer, Lockheed-California Co., Materials & Processes, Burbank, CA

    Harper-Tervet, J
    Northrop Advanced Systems Division, Pico Rivera, CA

    Pages: 16    Published: Jan 1987


    Abstract

    Current and near future requirements for fiber/resin component structures require component materials with superior impact resistance and damage tolerance coupled with good environmental performance. Optimization of the fabrication process for the final matrix resin selection for production of high quality parts with minimum reject rate can be achieved by use of the combination of two computer-assisted techniques developed at Lockheed. These are (1) a generic thermal analyzer model which incorporates heat transfer characteristics of the autoclave, tooling, and curing composite and (2) a matrix resin specific chemoviscosity model which takes into account viscosity, cure exotherm behavior, and chemical kinetics.

    Chemical characterization, rheometry, and differential scanning calorimetry (DSC) are vital in the assessment of cure behavior characteristics of each resin matrix studied. Matrix resin screening reveals considerable variation in viscosity, cure exotherm behavior, and reaction kinetics during the cure process, especially with matrix resins modified for improvement of damage tolerance.

    Keywords:

    in-process modeling, kinetics, enthalpy, chemoviscosity, cure parameters, damage tolerance


    Paper ID: STP24392S

    Committee/Subcommittee: D30.02

    DOI: 10.1520/STP24392S


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