STP1186

    Modeling of the Thermomechanical Fatigue of 63Sn-37Pb Alloy

    Published: Jan 1993


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    Abstract

    The stress-strain hysteresis behavior of 63Sn-37Pb solder joints in thermomechanical cycling was determined experimentally with a bimetallic loading frame for temperature excursions between — 30 and 130°C applied in triangular waveform for periods of 12, 24, 48, and 300 min. A computer simulation based on a constitutive equation previously formulated for steady-state creep conditions yielded reasonable agreement between the predicted and measured hysteresis behavior. An approximately linear relationship was found between the drop in maximum load in a hysteresis cycle and the measured fatigue cracked area.

    Keywords:

    solder, fatigue, thermomechanical fatigue, fatigue modeling, fatigue crack growth, steady-state creep, constitutive equation


    Author Information:

    Hacke, PL
    Graduate student, senior research associate, and professor, North Carolina State University, Raleigh, NC

    Sprecher, AF
    Graduate student, senior research associate, and professor, North Carolina State University, Raleigh, NC

    Conrad, H
    Graduate student, senior research associate, and professor, North Carolina State University, Raleigh, NC


    Paper ID: STP24251S

    Committee/Subcommittee: E08.05

    DOI: 10.1520/STP24251S


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