SEDL / STP / STP1049-EB / STP24061S

Role of the Oxide Film in the Transgranular Stress Corrosion Cracking of Copper

Cassagne, TB
Graduate student, The Johns Hopkins UniversityUNIREC, BaltimoreFriminy, MD

Kruger, J
Professor, The Johns Hopkins University, Baltimore, MD

Pugh, EN
Head of Metallurgy Division, National Bureau of Standards, Gaithersburg, MD

Pages: 17    Published: Jan 1990

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Abstract

Cyclic voltammetry, ellipsometry, and slow strain rate tests have been carried out on copper monocrystals in 0.1 M sodium acetate and 1 M sodium nitrite. These studies demonstrate that the presence of an oxide film is necessary but not sufficient to induce transgranular stress corrosion cracking, and that the growth rate and other characteristics of the oxide(s) are important factors. The results are discussed in terms of the film-induced cleavage model for cracking.