Effects of Hot Implantation of Helium in Copper on Bubble Formation Within Grains and on Grain Boundaries

    Published: Jan 1994

      Format Pages Price  
    PDF (272K) 13 $25   ADD TO CART
    Complete Source PDF (27M) 13 $180   ADD TO CART


    Effects of helium implantation rate and temperature on the evolution of the bubble microstructure in copper have been studied by transmission electron microscopy and positron annihilation techniques. Results on the temperature and implantation rate dependencies of bubble density in the grain interiors, helium flux to and bubble density at grain boundaries are described and discussed. The bubble nucleation in the grain interiors and the helium flux to grain boundaries can be understood within the framework of the di-atomic type homogeneous nucleation. The nucleation in the grain interiors appears to be diffusion controlled in the low temperature regime and gas dissociation controlled in the high temperature regime. Although the flux of helium reaching the boundaries remains very similar, the bubble density varies enormously from boundary to boundary. These differences are suggested to arise from the differences in the structure of the grain boundaries.


    Copper, helium implantation rate, bubble nucleation, grain interiors, grain boundaries, helium flux, implantation temperature, transmission electron microscopy, positron annihilation technique

    Author Information:

    Singh, BN
    Senior Research Scientist, Risø National Laboratory, Roskilde,

    Eldrup, M
    Senior Research Scientist, Risø National Laboratory, Roskilde,

    Möslang, A
    Senior Research Scientist, Kernforschungszentrum Karlsruhe, Karlsruhe,

    Committee/Subcommittee: E10.02

    DOI: 10.1520/STP23990S

    CrossRef ASTM International is a member of CrossRef.