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A Model for Primary Creep of 63Sn-37Pb Solder Pages: 13 Published: Jan 1994
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View License Agreement A micromechanical model of transient and steady-state creep as it applies to near eutectic Sn-Pb solder is presented. The material is described as a two-phase system having individual material properties, coupled by long-range internal stresses. The constitutive equations permit primary creep and the transition to steady state to be simulated by a numerical analysis in which the global mechanical response is dependent on the local stress state. The creep equations are calibrated through a series of shear strain measurements of thinwalled tubular solder specimens. Comparisons to predictions include cyclic shear straincontrolled experiments, creep relaxation, and combination ramp-hold shear strain and stress control environments. Application to finite element analysis of surface mount interconnects is described. | ||
