STP1136

    In-Plane and Out-of-Plane Coefficient of Thermal Expansion Characterization of New High-Performance Printed Circuit Boards Using Dilatometer and Thermomechanical Analysis

    Published: Jan 1991


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    Abstract

    This paper provides both in-plane and out-of-plane coefficient of thermal expansions (CTEs) of a high-performance QUATREX 5010 epoxy/Kevlar-120 fabric composite printed circuit board (PCB). Although both a quartz push-rod dilatometer and a thermomechanical analyzer (TMA) were used to measure the in-plane CTEs, the results indicate that the dilatometer is a better choice for accurate, precise determinations, especially for Kevlar/epoxy composites that had a CTE of 3.5 ppm/°C in the x and y direction. Based on our past experience testing various composite PCB materials based on E-glass, quartz, and Kevlar reinforcements, epoxy, polyimide, BT/epoxy, cyanate ester, and so forth, we recommend the dilatometer for accurately measuring the in-plane CTEs of Kevlar- and quartz-reinforced PCBs, which generally are below 9 ppm/°C. The TMA method, which is a faster and easier method than the dilatometer method, can be used reliably for accurately measuring the in-plane CTEs of E-glass-reinforced PCBs, which generally range from 12 to 16 ppm/°C.

    Keywords:

    printed circuit board (PCB), surface mount technology (SMT), coefficient of thermal expansion (CTE), dilatometers, thermomechanical analyzer (TMA), Kevlar, QUATREX epoxy


    Author Information:

    Ibrahim, AM
    Senior scientist, research associate, and research associate, Martin Marietta Laboratories, Baltimore, MD

    Klemens, ML
    Senior scientist, research associate, and research associate, Martin Marietta Laboratories, Baltimore, MD

    Cozzo, TF
    Senior scientist, research associate, and research associate, Martin Marietta Laboratories, Baltimore, MD


    Paper ID: STP23600S

    Committee/Subcommittee: E37.01

    DOI: 10.1520/STP23600S


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