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SEDL / STP / STP1032-EB / STP22860S
Fiber-Matrix Interface Failures
Park, HS Graduate student, graduate student, graduate student, assistant professor of mechanical engineeringprofessor of mechanical engineering, Center for Materials Science and Engineering, University of Texas at Austin, Austin, TX
Zong, GS Graduate student, graduate student, graduate student, assistant professor of mechanical engineeringprofessor of mechanical engineering, Center for Materials Science and Engineering, University of Texas at Austin, Austin, TX
Brown, LD Graduate student, graduate student, graduate student, assistant professor of mechanical engineeringprofessor of mechanical engineering, Center for Materials Science and Engineering, University of Texas at Austin, Austin, TX
Rabenberg, L Graduate student, graduate student, graduate student, assistant professor of mechanical engineeringprofessor of mechanical engineering, Center for Materials Science and Engineering, University of Texas at Austin, Austin, TX
Marcus, HL Graduate student, graduate student, graduate student, assistant professor of mechanical engineeringprofessor of mechanical engineering, Center for Materials Science and Engineering, University of Texas at Austin, Austin, TX
Pages: 10 Published: Jan 1989
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Abstract
Interface fractures of aluminum-graphite composites under transverse loading are expected to occur within the graphite fibers, but very near the interface. Residual stresses in aluminum, reinforced with the new high modulus pitch-based fibers, are much lower than would be expected based on simple elasticity calculations. The excess stress may be relaxed by shearing internal to the fibers or at the interface rather than by plastic flow of the matrix. The internal shearing also occurs during repeated thermal cycling of these composites; the fibers are repeatedly intruded, then extruded, during repeated temperature excursions.
Keywords:
aluminum graphite interfaces, fracture path, residual stresses, thermal fatigue, graphite fibers
Paper ID: STP22860S
Committee/Subcommittee: D30.04
DOI: 10.1520/STP22860S
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