SEDL / STP / STP947-EB / STP20028S

Ductility of Plated Metal Films: Its Measurement and Relationship to Microstructure

Nakahara, S
Member of technical staff, AT&T Bell Laboratories, Murray Hill, NJ

Okinaka, Y
Member of technical staff and consultant, Bell Communications Research, Murray Hill, NJ

Strashil, HK
Member of technical staff and consultant, Bell Communications Research, Murray Hill, NJ

Pages: 20    Published: Jan 1987

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Abstract

The mechanical bulge ductility tester developed previously by the authors (Nakahara et al.) is currently being considered by ASTM as a potential candidate for the standard ductility test apparatus for thin metal films. This paper describes (1) modifications and improvements made recently to the tester, (2) a theoretical analysis of the dependence of measured ductility on the size of the ball used to deform the specimen, and (3) the application of this tester to a study of the relationship between ductility and microstructure for copper films deposited by electroless and electrolytic methods.