STP1028

    Development of Silicophosphate Glass HAP-3

    Published: Jan 1988


      Format Pages Price  
    PDF Version (148K) 6 $25   ADD TO CART
    Complete Source PDF (18M) 6 $88   ADD TO CART


    Abstract

    Silicophosphate glass HAP with high thermal shock resistance was developed. As the thermal conductivity of glass can not be increased, thermal expansion coefficient was tried to make smaller and mechanical strength to make higher. P2O5-SiO2-Li2O system was investigated. In P2O5-SiO2-Li2O system, thermal expansion coefficient decreases and mechanical strength increases with SiO2 content, but chemical durability becomes worse. The weak chemical durability was improved by introducing Al2O3 in the system. HAP-3 selected from P2O5-SiO2-Li2O has higher thermal shock resistance, as 2.7 times as LHG-8, as 1.6 times high as LHG-5, low content of water and low concentration quenching.

    Keywords:

    HAP-3, high power, silicophosphate glass, concentration quenching, chemical durability, thermal shock resistance, fracture toughness, high repetition rate


    Author Information:

    Izumitani, T
    HOYA CORPORATION, Tokyo,

    Matsukawa, M
    HOYA CORPORATION, Tokyo,

    Hata, C
    HOYA CORPORATION, Tokyo,

    Tanaka, K
    HOYA CORPORATION, Tokyo,

    Toratani, H
    HOYA CORPORATION, Tokyo,


    Paper ID: STP18532S

    Committee/Subcommittee: F01.06

    DOI: 10.1520/STP18532S


    CrossRef ASTM International is a member of CrossRef.