SYMPOSIA PAPER Published: 01 January 1988
STP18532S

Development of Silicophosphate Glass HAP-3

Source

Silicophosphate glass HAP with high thermal shock resistance was developed. As the thermal conductivity of glass can not be increased, thermal expansion coefficient was tried to make smaller and mechanical strength to make higher. P2O5-SiO2-Li2O system was investigated. In P2O5-SiO2-Li2O system, thermal expansion coefficient decreases and mechanical strength increases with SiO2 content, but chemical durability becomes worse. The weak chemical durability was improved by introducing Al2O3 in the system. HAP-3 selected from P2O5-SiO2-Li2O has higher thermal shock resistance, as 2.7 times as LHG-8, as 1.6 times high as LHG-5, low content of water and low concentration quenching.

Author Information

Izumitani, T
Matsukawa, M
Hata, C
Tanaka, K
Toratani, H
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Details
Developed by Committee: F01
Pages: 13–18
DOI: 10.1520/STP18532S
ISBN-EB: 978-0-8031-5032-4
ISBN-13: 978-0-8031-4477-4