SEDL / STP / STP1296-EB / STP16228S

T^ϵ* Integral Under Plane Stress Crack Growth

Omori, Y
Visiting scientist, graduate student, and professor, University of Washington, Seattle, WA

Okada, H
Research engineer and institute professor, Georgia Institute of Technology, Computational Modeling Center, Atlanta, GA

Ma, L
Visiting scientist, graduate student, and professor, University of Washington, Seattle, WA

Atluri, SN
Research engineer and institute professor, Georgia Institute of Technology, Computational Modeling Center, Atlanta, GA

Kobayashi, AS
Visiting scientist, graduate student, and professor, University of Washington, Seattle, WA

Pages: 11    Published: Jan 1997

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Abstract

The T^ϵ* integral values associated with stable crack growth in A606 HSLA steel SEN specimens were determined experimentally and numerically. The displacement fields obtained through Moiré interferometry and elastic-plastic finite element analysis were used to evaluate T^ϵ* associated with the moving crack tip. T^ϵ* decreased with the reduction in the size of the integration contour, T^ϵ, and continually increased with stable crack growth in this specimen. The measured and computed crack-tip opening angle (CTOA), on the other hand, was a constant 15° during stable crack growth after dropping from the measured and computed initial high values of 35 and 57°, respectively.