STP1340: Characteristics and Evaluation Methods of Carrier Recombination Lifetimes in High-quality Silicon Wafers

    Kitagawara, Y
    Manager, researcher, researcher, and section chief, SEH R&D Center, Shin-Etsu Handotai Co., Ltd., Annaka-shi, Gunma-ken,

    Yoshida, T
    Manager, researcher, researcher, and section chief, SEH R&D Center, Shin-Etsu Handotai Co., Ltd., Annaka-shi, Gunma-ken,

    Koide, T
    Manager, researcher, researcher, and section chief, SEH R&D Center, Shin-Etsu Handotai Co., Ltd., Annaka-shi, Gunma-ken,

    Hayamizu, Y
    Manager, researcher, researcher, and section chief, SEH R&D Center, Shin-Etsu Handotai Co., Ltd., Annaka-shi, Gunma-ken,

    Pages: 15    Published: Jan 1998


    Abstract

    Lifetime quality and the evaluation methods are discussed for (i) high-quality bulk Czochralski-grown crystals, (ii) polished wafers, and (iii) epitaxial layers in p/p+ wafers, (i) To determine the bulk lifetime value accurately for high-quality Si, it is important to measure a bulk sample 1–2cm-thick by a photoconductive decay method based on JIS: H0604-1995 or ASTM: F28-75. This high-sensitivity measurement reveals a new phenomenon of oxygen-related recombination-enhanced lifetime shift. (ii) For wafer analyses using an iodine-ethanol chemical passivation technique, the surface recombination velocities are determined precisely, (iii) To evaluate epi-layer lifetime qualities of p/p+ wafers, “Short-Wavelength Laser-Excited Photoluminescence (PL) Technique” is useful. Applying this technique to a heavy-metal gettering study, it is found that, even in p/p+ wafers with excellent Fe gettering capability, optimization of the substrate oxygen precipitation and the stability of the gettering sites are important.

    Keywords:

    bulk lifetime, photoconductive decay, lifetime shift, chemical passivation, surface recombination velocities, epitaxial layers, p/p, +, photoluminescence, gettering


    Paper ID: STP15711S

    Committee/Subcommittee: F01.10

    DOI: 10.1520/STP15711S


    CrossRef ASTM International is a member of CrossRef.