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Influence of Iron and Copper on Minority Carrier Recombination Lifetime in Silicon Pages: 9 Published: Jan 1998
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View License Agreement Source: STP1340-EB Abstract A contamination experiment was carried to prove the possibility of a quantitative determination of the Fe-concentration in the high injection level region for p-type silicon. Calculation factors for two formulas were obtained, one assuming only FeB as life-time killer and another general one. A comparison between DLTS-, SPV- and μ-PCD-results showed a very good correlation of all instruments. Copper was proved to have also a strong influence on lifetime measurement, especially in n-type Silicon. Cu is suspected to affect the efficiency of Oxide passivation. Nitrogen also seemed to have a considerable influence at least in connection with a Cu contamination. Keywords: carrier lifetime, recombination, silicon, μ-PCD, Iron, Copper Paper ID: STP15710S Committee/Subcommittee: F01.10 DOI: 10.1520/STP15710S ASTM International is a member of CrossRef. | ||