STP1340

    Metallic Contamination from Wafer Handling

    Published: Jan 1998


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    Abstract

    The surface photovoltage (SPV) method is used to characterize metallic contamination introduced by wafer handling. It is shown that particles from handling equipment introduce significant levels of metallic contamination. In most cases the correlation between particle contamination and metallic contamination is excellent. We also find that metallic contamination can be introduced during handling in areas where no particles are detected. However, in order to take manufacturing decisions based on surface photovoltage data, one must understand the strengths and limitations of the technique and avoid its pitfalls.

    Keywords:

    microcontamination, metallic contamination, iron contamination, particle contamination, surface photovoltage, wafer handling


    Author Information:

    Beaudoin, F
    M. App. Sc. student and professor, GCM, école Polytechnique, Montreal, Quebec

    Simard-Normandin, M
    Senior scientist, Center for Microanalysis, Nepean, Ontario

    Meunier, M
    M. App. Sc. student and professor, GCM, école Polytechnique, Montreal, Quebec


    Paper ID: STP15707S

    Committee/Subcommittee: F01.10

    DOI: 10.1520/STP15707S


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