SYMPOSIA PAPER Published: 01 January 1998
STP15707S

Metallic Contamination from Wafer Handling

Source

The surface photovoltage (SPV) method is used to characterize metallic contamination introduced by wafer handling. It is shown that particles from handling equipment introduce significant levels of metallic contamination. In most cases the correlation between particle contamination and metallic contamination is excellent. We also find that metallic contamination can be introduced during handling in areas where no particles are detected. However, in order to take manufacturing decisions based on surface photovoltage data, one must understand the strengths and limitations of the technique and avoid its pitfalls.

Author Information

Beaudoin, F
GCM, école Polytechnique, Montreal, Quebec, Canada
Simard-Normandin, M
Center for Microanalysis, Nepean, Ontario, Canada
Meunier, M
GCM, école Polytechnique, Montreal, Quebec, Canada
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Details
Developed by Committee: F01
Pages: 219–225
DOI: 10.1520/STP15707S
ISBN-EB: 978-0-8031-5389-9
ISBN-13: 978-0-8031-2489-9