SEDL / STP / STP1340-EB / STP15705S

Application and Comparison of SPV and μPCD for Iron Measurement in Silicon Wafer Manufacturing

Pan, Y
Senior Engineer, SEH America, Inc., Vancouver, WA

Pages: 7    Published: Jan 1998

Download this paper for $25 PDF (124K)          View License Agreement
Abstract

Minority carrier lifetime tools μ-PCD and SPV diffusion length are used in process monitoring in silicon wafer manufacturing for metal contamination control. In p-type silicon, both lifetime tools had been correlated with DLTS so as to be able to measure [Fe] concentration. In comparison of these two methods, a good correlation was obtained in a large range with extrapolation to the upper 1e10/cm³ level using Czochralski (CZ) silicon samples. In general, SPV resulted in a higher [Fe] than μ-PCD methods. At lower 1e10/cm³ level, the boron and oxygen concentrations significantly limit the [Fe] detection capability of μ-PCD, but less significantly on that of SPV.