STP1359: Mixed-Mode Fracture Behavior of Silica Particulate Filled Epoxide Resin

    Kishimoto, K
    Professor, graduate student, and professor, Tokyo Institute of Technology, Tokyo,

    Notomi, M
    Assistant professor, Meiji University, Kawasaki,

    Kadota, S
    Professor, graduate student, and professor, Tokyo Institute of Technology, Tokyo,

    Shibuya, T
    Professor, graduate student, and professor, Tokyo Institute of Technology, Tokyo,

    Kawamura, N
    Research scientist and chief research scientist, Research and Development Center, Toshiba Corporation, Kawasaki,

    Kawakami, T
    Research scientist and chief research scientist, Research and Development Center, Toshiba Corporation, Kawasaki,

    Pages: 14    Published: Jan 1999


    Abstract

    Silica particulate filled epoxide resins are used as encapsulant materials in semiconductor packaging. In the present paper, fracture behavior of the epoxide resin, containing 70 wt% silica particles, have been studied at room temperature and high temperature, that is, 250°C. The three-point and four-point bending tests were performed to obtain Mode I and mixed-mode fracture toughness, respectively. The specimen fractured in a brittle manner under room temperature conditions, and the results obeyed the maximum hoop stress criterion. On the other hand, the results at high temperature showed a relatively low dependency on Mode II stress intensity factors. Fracture surface were observed in a scanning laser microscope. Finite element analysis, taking into account the microstructure of the material, have been conducted in order to investigate the influence of temperature on mixed-mode fracture behavior. Local fracture criteria were considered for the silica particles and the epoxide resin. The material constants in criteria were estimated from the bending strength and the Mode I fracture toughness of the material. Good agreement between experimental and numerical results was obtained for the fracture boundary curves on the Mode I and Mode II stress intensity diagram.

    Keywords:

    semiconductor package, silica particulate filled epoxide resin, mixed mode fracture, fracture boundary curve, maximum hoop stress criterion, Richard's criterion, FEM analysis, local failure criterion


    Paper ID: STP14247S

    Committee/Subcommittee: E08.01

    DOI: 10.1520/STP14247S


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