STP1201

    Predicting Creep Behavior of Silicon Nitride Components Using Finite Element Techniques

    Published: Jan 1994


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    Abstract

    The creep of silicon nitride tensile specimens has been modeled and incorporated into finite element software to predict the behavior of structural components. The experimental results are for the creep deformation of HIP'ed, yttria-doped silicon nitride at temperatures up to 1400°C. Results are for both homogeneous and joined specimens. This experimental data base was modeled using two approaches: Arrhenius law representation of the steady state phase, and theta projection method representation of both primary and secondary stages. The Arrhenius law has been incorporated into commercial finite element software and used to predict the creep deformation behavior and time to failure for a simulated component represented by a notched tensile specimen.

    Keywords:

    silicon nitride, finite element method, creep experiments, creep modeling, high temperature deformation


    Author Information:

    Wade, JA
    Research Engineer and Senior Research Engineer, Saint-Gobain/Norton Industrial Ceramics Corporation, Northboro, MA

    White, CS
    Research Engineer and Senior Research Engineer, Saint-Gobain/Norton Industrial Ceramics Corporation, Northboro, MA

    Wu, FJ
    Senior Research Engineer, Saint-Gobain/Norton Industrial Ceramics Corporation, currently PDA Engineering, Burlington, MA


    Paper ID: STP12793S

    Committee/Subcommittee: C28.01

    DOI: 10.1520/STP12793S


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