New Developments in Full Field Strain Measurements Using Speckles

    Published: Jan 1997

      Format Pages Price  
    PDF (684K) 14 $25   ADD TO CART
    Complete Source PDF (5.8M) 14 $55   ADD TO CART


    Speckle photography is a versatile full field technique for measuring displacement and strain. However, the wet photographic process and tedium of fringe analysis had made it impractical for application to industrial problems. This paper describes a recent development of combining digital recording and image analysis that has rendered the technique a practical tool. In addition, through the development of SIEM (Speckle Interferometry with Electron Microscopy) the technique has been extended into micromechanics domain whereby strain fields within a region only a few micron square can be mapped with confidence. Several examples of this application are presented.


    speckle, interferometry, digital image processing, electron microscope, micro-mechanics, experimental mechanics, stress/strain analysis

    Author Information:

    Chiang, F-P
    Leading Professor and Chair, State University of New York at Stony Brook, Stony Brook, NY

    Wang, Q
    Research Assistant, State University of New York at Stony Brook, Stony Brook, NY

    Lehman, F
    Principle Engineer, Instron Corporation, Canton, MA

    Committee/Subcommittee: E08.03

    DOI: 10.1520/STP11898S

    CrossRef ASTM International is a member of CrossRef.