STP1426: A Round Robin Interlaboratory Comparison of Thermal Conductivity Testing Using the Guarded Hot Plate up to 1000°C

    Albers, MA
    Research Scientist, Johns Manville Technical Center, Littleton, CO

    Pages: 15    Published: Jan 2002


    Abstract

    A round robin interlaboratory comparison of thermal conductivity measurements was performed using the Guarded Hot Plate apparatus at temperatures from about 0°C to 1000 °C. There were twelve participating laboratories including four national laboratories in three different countries. A statistical analysis was performed and the variation in measurement results is discussed. Both within laboratory and between laboratory variability is analyzed. A definite conclusion of this comparison is that measurement variation increases progressively with increasing temperature. As a result there is a need for the U.S. national laboratory, the National Institute of Standards & Technology, to develop high temperature testing capability and then high temperature thermal conductivity reference standards.

    Keywords:

    Interlaboratory comparison, round robin, thermal conductivity, thermal measurements, Guarded Hot Plate, C 177, ISO-8302, high temperature, C 1114


    Paper ID: STP11008S

    Committee/Subcommittee: C16.30

    DOI: 10.1520/STP11008S


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