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Tensile Testing of Thin Films Using Electrostatic Force Grip Pages: 15 Published: Jan 2001
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View License Agreement Source: STP1413-EB Abstract Thin film tensile testers using an electrostatic force grip system were developed to enable increased reliability in MEMS devices. This grip system uses electrostatic force to chuck a thin film specimen. The chucking force is easily controlled and the damage to the specimen during testing can be minimized. With these testers, silicon, silicon-dioxide, and silicon-nitride thin films fabricated with surface micromachining were tensile-tested in a vacuum and in air. The specimens were 2 to 10 im wide, 30 to 300 m long, and 0.7 to 2.0 m thick. We compare the strength of these films and discuss the fracture properties of the films and the effect of the environment.
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