Cross Comparison of Direct Strength Testing Techniques on Polysilicon Films

    Published: Jan 2001

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    Several direct and indirect testing techniques to characterize the strength and distribution in strength of structural thin films have been developed with widely varying results appearing in the literature (roughly 1 to 4 GPa for polysilicon). Much of the variation between authors has been explained in terms of microstructural differences, sample size effects, and release techniques. Five laboratories participated in a cross comparison of direct tensile testing techniques in an effort to study these variations; all samples were fabricated and released simultaneously at Sandia National Labs to eliminate material variations. Sample lengths ranged from 15 to 1000 μm long. All the samples were fabricated with a thickness of 2.5 μm. The distributions in strength are reported along with a tabulation of mean, standard deviation, and Weibull modulus of fracture strength for each lab.


    polysilicon, MEMS, thin film, tensile, fracture, strength, testing, distribution

    Author Information:

    LaVan, DA
    Massachusetts Institute of TechnologyChildren's Hospital, CambridgeBoston, MAMA

    Tsuchiya, T
    Toyota Central Research and Development Laboratories, Nagakute,

    Coles, G
    The Johns Hopkins University, Baltimore, MD

    Knauss, WG
    Graduate, Aeronautical Laboratories, California Institute of Technology, Pasadena, CA

    Chasiotis, I
    Graduate, Aeronautical Laboratories, California Institute of Technology, Pasadena, CA

    Read, D
    National Institute of Standards and Technology, Boulder, CO

    Committee/Subcommittee: E08.01

    DOI: 10.1520/STP10977S

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