Volume 18, Issue 3 (May 1990)
A Method for Uniform Shear Stress-Strain Analysis of Adhesives
The adaptation of the Iosipescu test as a method for determination of the stress and strain to failure and the shear modulus of adhesives under uniform shear conditions is described. The design and performance of a number of special purpose instruments and jigs to facilitate sample preparation, bond line thickness measurement, and shear displacement determinations are also described. Representative shear stress-strain curves of a nylon-epoxy film adhesive are presented.