(Received 13 December 1988; accepted 9 November 1989)
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The adaptation of the Iosipescu test as a method for determination of the stress and strain to failure and the shear modulus of adhesives under uniform shear conditions is described. The design and performance of a number of special purpose instruments and jigs to facilitate sample preparation, bond line thickness measurement, and shear displacement determinations are also described. Representative shear stress-strain curves of a nylon-epoxy film adhesive are presented.
Materials Mechanics Engineer,
Technical Manager, Rhone-Poulenc Silicones, Braeside, Victoria
Research Chemist, Materials Research Laboratory, Ascot Vale, Melbourne, Victoria
Stock #: JTE12473J