Volume 32, Issue 4 (July 2004)

    Numerical Analysis for Small Punch Creep Tests by Finite-Element Method

    (Received 26 September 2003; accepted 23 January 2004)

    CODEN: JTEOAD

      Format Pages Price  
    PDF 6 $25   ADD TO CART


    Abstract

    A numerical study is presented that simulates small punch creep (SP-C) tests using a finite-element method (FEM). The objective of the present study is to develop a miniaturized testing methodology for high-temperature creep properties. The numerical simulations have been shown to produce deflection versus time curves that are quantitatively similar to the experimental results obtained on tungsten-alloyed 9 % Cr ferritic steels. It is also demonstrated that the numerically predicted curves show the steady state (secondary) creep stage. Furthermore, the numerical simulations reveal that the magnitude of the equivalent stress in the central region of the SP-C specimen shows no significant change with respect to time at the secondary creep stage, supporting the use of the present SP-C testing method to characterize the secondary creep deformation rate. Finally, an approximate equation is proposed for the assessment of the equivalent stress in the SP-C specimen in terms of the load and testing parameters.


    Author Information:

    Zhai, PC
    Fracture Research Institute, Graduate School of Engineering, Tohoku University, Aoba-ku, Sendai

    State Key Laboratory for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan,

    Hashida, T
    Fracture Research Institute, Graduate School of Engineering, Tohoku University, Aoba-ku, Sendai

    Komazaki, S
    Muroran Institute of Technology, Muroran, Hokkaido

    Zhang, QJ
    State Key Laboratory for Materials Synthesis and Processing, Wuhan University of Technology, Wuhan,


    Stock #: JTE12250

    ISSN: 0090-3973

    DOI: 10.1520/JTE12250

    ASTM International is a member of CrossRef.

    Author
    Title Numerical Analysis for Small Punch Creep Tests by Finite-Element Method
    Symposium , 0000-00-00
    Committee E08