Nondestructive Evaluation of Bond Quality of Bimetallic Strips Using Acoustic Emission

    Volume 13, Issue 5 (September 1985)

    ISSN: 0090-3973

    CODEN: JTEOAD

    Page Count: 3


    Murthy, CRL
    Lecturer and Project Assistant, Indian Institute of Science, Bangalore,

    Brahma, KK
    Lecturer and Project Assistant, Indian Institute of Science, Bangalore,

    Abstract

    Acoustic emission (AE) appears to hold good promise for nondestructive evaluation of bond strength of bimetallic strips in two ways: (1) as a quality control tool in batch sampling and (2) as a 100% inspection method. A program has been initiated at the Aerospace Engineering Department of the Indian Institute of Science to explore the feasibility of utilizing the acoustic emission technique for evaluation of bond strength of bimetallic strips. As a first step, acoustic emission was monitored during tensile testing of copper-lead bimetallic strips. The results obtained during these tests indicate differences in AE activity between specimens with poor and good bonding at very small loads which can be utilized for inspecting the bond quality.


    Paper ID: JTE10965J

    DOI: 10.1520/JTE10965J

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    Title Nondestructive Evaluation of Bond Quality of Bimetallic Strips Using Acoustic Emission
    Symposium , 0000-00-00
    Committee E07