Evaluating Process Yield for LED Assembly under Undetected Process Parameter Change

    Volume 40, Issue 3 (May 2012)

    ISSN: 0090-3973

    CODEN: JTEOAD

    Published Online: 1 March 2012

    Page Count: 6


    Tai, Y. T.
    Dept. of Information Management, Kai Nan Univ., Taoyuan,

    (Received 8 August 2011; accepted 25 November 2011)

    Abstract

    The technology of light emitting diode (LED) assembly has become more popular due to the high demand for LED backlight modules, which can provide desirable characteristics such as a wide color gamut, a high dimming ratio, a long lifetime, and high power efficiency. For LED assembly processes, the distance between LEDs is one of the key parameters because the uniformity of an LED backlight module can be affected by it. In order to obtain good optical performance of an LED backlight module, the process yield of the parameter needs to be controlled well. Conventionally, process yields of LED assembly processes are evaluated using typical capability index methods under the essential assumption that the processes are stable. However, some inevitable process parameter changes regarding the distance between LEDs might exist on the shop floor. In order to evaluate the process yield more accurately, this paper presents an accommodated capability index method for process yield evaluation under undetected process parameter changes. For illustration purposes, an application is presented.


    Paper ID: JTE104263

    DOI: 10.1520/JTE104263

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    Author
    Title Evaluating Process Yield for LED Assembly under Undetected Process Parameter Change
    Symposium , 0000-00-00
    Committee E11