Volume 23, Issue 1 (January 1995)

    On the Nonuniform Distributions of Temperature and Thermal Stress in DTA Testing

    (Received 12 May 1994; accepted 12 July 1994)

    CODEN: JTEOAD

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    Abstract

    A nonuniform distribution of temperature across the solid specimen during differential thermal analysis (DTA) can cause thermal stress. The effect of such thermal stress and the resulting thermal strain energy on the DTA results is theoretically analyzed. It is found that, for most solid metallic specimens, the temperature nonuniformity in the solid specimen is less than 0.18 °C during normal DTA operation. The thermal stress and thermal strain are usually very small due to the small size of the specimen, and they do not have a substantial effect on the DTA results.


    Author Information:

    Zhu, YT
    Center for Materials Science and Engineering, The University of Texas at Austin, Austin, TX

    Devletian, JH
    Oregon Graduate Institute, Portland, OR

    Chen, SJ
    Oregon Graduate Institute, Portland, OR

    Manthiram, A
    Center for Materials Science and Engineering, The University of Texas at Austin, Austin, TX


    Stock #: JTE10401J

    ISSN: 0090-3973

    DOI: 10.1520/JTE10401J

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    Author
    Title On the Nonuniform Distributions of Temperature and Thermal Stress in DTA Testing
    Symposium , 0000-00-00
    Committee C16