A Computerized Test System for Thermal-Mechanical Fatigue Crack Growth

    Volume 14, Issue 6 (November 1986)

    ISSN: 0090-3973

    CODEN: JTEOAD

    Page Count: 9


    Marchand, N
    Research Assistant and Professor, Massachusetts Institute of Technology, Cambridge, MA

    Pelloux, RM
    Research Assistant and Professor, Massachusetts Institute of Technology, Cambridge, MA

    (Received 11 July 1985; accepted 22 April 1986)

    Abstract

    A computerized testing system to measure fatigue crack growth under thermal-mechanical fatigue conditions is described. Built around a servohydraulic machine, the system is capable of a push-pull test under stress- or strain-controlled conditions in the temperature range of 25 to 1050°C. Temperature and mechanical strain are independently controlled by the closed-loop system to simulate complex inservice strain-temperature relationship.

    A d-c electrical potential method is used to measure crack growth rates. The correction procedure of the potential signal to take into account powerline and RF-induced noises and thermal changes is described. It is shown that the potential drop technique can be used for physical mechanism studies and for modelling crack tip processes.


    Paper ID: JTE10347J

    DOI: 10.1520/JTE10347J

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    Author
    Title A Computerized Test System for Thermal-Mechanical Fatigue Crack Growth
    Symposium , 0000-00-00
    Committee E08