Capability Testing Based on Subsamples: A Case on Photolithography Process Control in Wafer Fabrication

    Volume 38, Issue 2 (March 2010)

    ISSN: 0090-3973

    CODEN: JTEOAD

    Published Online: 3 December 2009

    Page Count: 10


    Liao, Mou-Yuan
    Dept. of Finance, Yuanpei Univ., HsinChu, Taiwan,

    Kang, He-Yau
    Dept. of Industrial Engineering and Management, National Chin-Yi Univ. of Technology, Taiping City, Taichung Country 411 Taiwan,

    Lee, Amy H. I.
    Dept. of Industrial Management, Chung Hua Univ., Hsinchu, Taiwan,

    Wu, Chien-Wei
    Dept. of Industrial Engineering and Systems Management, Feng Chia Univ., Seatwen, Taichung, Taiwan,

    (Received 21 February 2009; accepted 28 September 2009)

    Abstract

    Photolithography is considered as the bottleneck in semiconductor manufacturing, and a good control of critical dimension, alignment accuracy, and photoresist thickness is essential for maintaining a high quality level of wafers. In this study, a photolithography process in a semiconductor factory is investigated, and the process performance of critical dimension, alignment accuracy, and photoresist thickness measurement is tested based on the process capability index CPMK. Critical values required for hypothesis testing are obtained based on subsamples. This investigation is useful to practitioners in making reliable decision in capability determination. By applying our research results to analyze the process performance with the three critical parameters, a production department can trace and improve the photolithography process.


    Paper ID: JTE102388

    DOI: 10.1520/JTE102388

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    Author
    Title Capability Testing Based on Subsamples: A Case on Photolithography Process Control in Wafer Fabrication
    Symposium , 0000-00-00
    Committee E11