ISSN: 1945-7553
CODEN: JTEVAB
Published Online: 3 December 2009
Page Count: 10

Capability Testing Based on Subsamples: A Case on Photolithography Process Control in Wafer Fabrication

Liao, Mou-Yuan
Dept. of Finance, Yuanpei Univ., HsinChu, Taiwan,

Kang, He-Yau
Dept. of Industrial Engineering and Management, National Chin-Yi Univ. of Technology, Taiping City, Taichung Country 411 Taiwan,

Lee, Amy H. I.
Dept. of Industrial Management, Chung Hua Univ., Hsinchu, Taiwan,

Wu, Chien-Wei
Dept. of Industrial Engineering and Systems Management, Feng Chia Univ., Seatwen, Taichung, Taiwan,

(Received 21 February 2009; accepted 28 September 2009)

Abstract

Photolithography is considered as the bottleneck in semiconductor manufacturing, and a good control of critical dimension, alignment accuracy, and photoresist thickness is essential for maintaining a high quality level of wafers. In this study, a photolithography process in a semiconductor factory is investigated, and the process performance of critical dimension, alignment accuracy, and photoresist thickness measurement is tested based on the process capability index C_PMK. Critical values required for hypothesis testing are obtained based on subsamples. This investigation is useful to practitioners in making reliable decision in capability determination. By applying our research results to analyze the process performance with the three critical parameters, a production department can trace and improve the photolithography process.

Keywords:
photolithography, critical dimension, critical value, alignment accuracy, photoresist thickness, process capability, subsamples

Paper ID: JTE102388
DOI: 10.1520/JTE102388
ASTM International is a member of CrossRef.